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School of Mechanical and Materials Engineering Faculty

Indranath Dutta

Indranath Dutta

Director, School of Mechanical & Materials Engineering

Sloan 201 / Dana 149B
509-335-8654 / 509-335-8354


  • Ph.D. in Materials Science and Engineering, University of Texas at Austin, 1988
  • M.S. in Metallurgy and Materials Science, Case Western Reserve University, Cleveland, 1985
  • B.Tech. (Hons.) in Metallurgical Engineering, Indian Institute of Technology, Kharagpur, India, 1983

Research Interests

  • Multi-physics phenomena in Materials Science – thermal/mechanical/electrical/electromagnetic interactions
  • Near-interface effects in multi-component materials, with emphasis on materials for microelectronics
  • Materials reliability in micro-systems and composites
  • Electrically-activated manufacturing at nano to meso scales – nanolithography, electromagnetic jigsaw

Selected Publications

Complete List of Publications on Google Scholar

  1. Dutta, “A Constitutive Model for Creep of Lead-Free Solders Undergoing In-situ Microstructural Coarsening: A First Report”, J. Electronic Mater., 32, no. 4 (2003) pp. 1-7.
  2. Pan, R. A. Marks, I. Dutta and S. Jadhav, “A Miniaturized Impression Creep Test for Characterization of On-substrate Solder Ball Grid Arrays” Rev. Sci. Instrum., 75, 2004, pp. 5244-5252.
  3. Pan, I. Dutta, S. Ma, B.S. Majumdar and S. Harris, “Role of Shape-Memory Alloy Reinforcements on Strain Evolution in Lead-Free Solder Joints”, J. Electronic Mater., 35, 2006, pp.1902-1913.
  4. Long, T. Chen and I. Dutta, “Effect of Current Crowding on Microstructural Evolution at Rail-Armature Contacts in Railguns”, IEEE Trans. Magnetics, 43, 2007, pp. 3278-3286.
  5. Dutta, R. Raj, P. Kumar, T. Chen, C. M. Nagaraj, J. Liu, M. Renavikar and V. Wakharkar, Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications”, J. Electronic Mater., 38, pp. 2735-2745, 2009.
  6. Kumar and I. Dutta, “Influence of electric current on diffusionally accommodated sliding at hetero-interfaces”, Acta Mater. 59 (2011) 2096-2108.
  7. Kumar, I. Dutta and M. S. Bakir, “Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)”, J. Elec. Mater. 41 (2012) 322 – 335.
  8. Kumar and I. Dutta, “Effect of Substrate Surface on Electromigration Induced Interfacial Sliding at Hetero-Interfaces”, J. of Phys. D: Appl. Phys. 46 (15), 2013, 155303.
  9. Huang, P. Kumar, I. Dutta, J. H. L. Pang, R. Sidhu, M. Renavikar and R. Mahajan, “A General Methodology for Calculating Mixed Mode Stress Intensity Factors and Fracture Toughness of Solder Joints with Interfacial Cracks”, Eng. Fract. Mech., 131 (2014) pp. 9-25.
  10. Talebanpour, Z. Huang, Z. Chen and I. Dutta, “Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages”, J. Electronic Mater., 45 (1), 2016, 791-801.
  11. Kumar, I. Dutta, Z. Huang and P. Conway, “Chapter 4: Microstructural and Reliability Issues of TSV”, in 3D Microelectronic Packaging, Y. Li and D. Goyal, eds., Springer Series in Advanced Microelectronics, Vol. 57, 2017, pp. 71-100.
  12. Das Mahapatra, B.S. Majumdar, I. Dutta, “Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate”, J. Electronic Mater., 46, 2017, 4062-4075.